Aku turut berduka cita

Aku turut berduka cita

Hasil (Inggris) 1:

Please accept my condolences

Hasil (Inggris) 2:

Process zone P3 is the solder reflow zone. In zone P3, the
temperature is quickly raised above the liquidus point
of solder to 260°C (500°F) for optimum results. The
dwell time above the liquidus point of solder should be
between 60 and 120 seconds. This is to assure proper
coalescing of the solder paste into liquid solder and the
formation of good solder connections. Beyond the recommended dwell time the intermetallic growth within
the solder connections becomes excessive, resulting in
the formation of weak and unreliable connections. The
temperature is then rapidly reduced to a point below
the solidus temperature of the solder to allow the solder
within the connections to freeze solid.